Tuffbond 322


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Paketleme: 50 ML



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Üretici: Hernon

TDS:

Tuffbond ® 322 is a transparent 1: 1 flexible, low viscosity, general purpose resin system used for casting, coating and encapsulation of electrical and electronic components. This unique product has been formulated to combine ease of use with optimum physical, thermal and electrical insulating properties.


Tipik uygulamalar

  • Saksı elektronik kartları

  • Çömlekçilik pil bileşenleri

  • Elektrik ve elektronik bileşenleri kapsülleme

  • Transformers

  • Bobinler ve bobinler

  • Solenoidler

  • Mikro devre

Paketleme 50 ML
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